BM57B0.6-10DS/2-0.3V(51)

Hersteller-Teilenummer
BM57B0.6-10DS/2-0.3V(51)
Hersteller
Hirose
Paket/Karton
-
Datenblatt
Herunterladen
Beschreibung
CONN RCPT 0.3MM SMD 10POS + 2PWR
Lagerbestand
35000

Angebot anfordern (RFQ)

* Kontaktname:
  Unternehmen:
* E-Mail:
  Telefon:
  Kommentar:
Hersteller :
Hirose
Produktkategorie :
Arrays, Edge Type, Mezzanine (Board to Board)
Connector Type :
Receptacle, Center Strip Contacts
Contact Finish :
Gold
Contact Finish Thickness :
-
Features :
Solder Retention
Mated Stacking Heights :
0.6mm
Mounting Type :
Surface Mount
Number of Positions :
10
Number of Rows :
2
Product Status :
Active
Datenblätter
BM57B0.6-10DS/2-0.3V(51)

Herstellerbezogene Produkte

Katalogbezogene Produkte

Ähnliche Produkte

Teil Hersteller Lagerbestand Beschreibung
BM57B0.6-10DP/2-0.3V(51) Hirose 35,000 CONN HDR 0.3MM SMD 10POS + 2PWR
BM57B0.6-10DP/2-0.3V(53) Hirose 35,000 CONN HDR 0.3MM SMD 10POS + 2PWR
BM57B0.6-10DS/2-0.3V(53) Hirose 35,000 CONN RCPT 0.3MM SMD 10POS + 2PWR
BM57SPP03MC2-000401 Microchip Technology 35,000 MODULE WIRELESS BLUETOOTH
BM57SPP03MC2-000501 Microchip Technology 35,000 MODULE WIRELESS BLUETOOTH
BM57SPP05MC2-000101 Microchip Technology 35,000 MODULE WIRELESS BLUETOOTH
BM57SPP05MC2-000401 Microchip Technology 35,000 MODULE WIRELESS BLUETOOTH
BM57SPP05MC2-AD0201 Microchip Technology 35,000 MODULE WIRELESS BLUETOOTH
BM57SPP05NC2-0001AA Microchip Technology 35,000 MODULE WIRELESS BLUETOOTH
BM57SPPS3MC2-000301 Microchip Technology 35,000 MODULE WIRELESS BLUETOOTH
BM57SPPS5MC2-000301 Microchip Technology 35,000 MODULE WIRELESS BLUETOOTH
BM57SPPS5MC2-000401 Microchip Technology 35,000 MODULE WIRELESS BLUETOOTH