Thermal - Pads, Sheets
- Manufacturer：
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- AMEC Thermasol (3)
- CUI Devices (39)
- Parker Chomerics (4)
- Shiu Li Technology (120)
- T-Global Technology (129)
- Backing, Carrier：
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- Outline：
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- Product Status：
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- Shape：
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- Thermal Conductivity：
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- Thermal Resistivity：
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- Type：
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334 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | THERM PAD 41.25MMX4... |
7
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 15MMX15M... |
23
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 30MMX30M... |
15
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | TPCM 7125 9X9IN |
15
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | TPCM 7200 9X9IN |
13
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | TPCM 7250 9X9IN |
20
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | TPCM 7400 9X9IN |
11
In-stock
|
Get Quote | ||
|
|
T-Global Technology | NON-SILICONE THE... |
6
In-stock
|
Get Quote | ||
|
|
T-Global Technology | NON-SILICONE THE... |
3
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | COOLZORB-ULTRA,0.... |
10
In-stock
|
Get Quote | ||
|
|
T-Global Technology | NON-SILICONE THE... |
3
In-stock
|
Get Quote | ||
|
|
T-Global Technology | NON-SILICONE THE... |
2
In-stock
|
Get Quote | ||
|
|
T-Global Technology | NON-SILICONE THE... |
2
In-stock
|
Get Quote | ||
|
|
T-Global Technology | NON-SILICONE THE... |
5
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | TFLEX SF850 |
7
In-stock
|
Get Quote | ||
|
|
T-Global Technology | NON-SILICONE THE... |
3
In-stock
|
Get Quote | ||
|
|
T-Global Technology | NON-SILICONE THE... |
5
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | TFLEX SF870 |
3
In-stock
|
Get Quote | ||
|
|
T-Global Technology | NON-SILICONE THE... |
5
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | TFLEX SF890 |
2
In-stock
|
Get Quote |
